EVA – ETHYLENE VINYL ACETATE
|
Method |
Grade |
Melt Flow |
Density |
Attributes & Applications |
| VS410 (details in PDF) |
7.0 g/10min |
0.956 g/㎤ |
Processability, Mechanical Properties, Bead Foaming Properties(SHOE SOLE, Electric Wire BASE RESIN (outer semiconductive shield)). | |
|
Foaming |
VS420 (details in PDF) |
7.0 g/10min |
0.964 g/㎤ |
Processability, Mechanical Properties, Bead Foaming Properties(SHOE SOLE). |
| VS430 (details in PDF) |
7.7 g/10min |
0.960 g/㎤ |
Processability, Mechanical Properties, Bead Foaming Properties(SHOE SOLE, Electric Wire BASE RESIN (inner semiconductive layer)). | |
| VS440 (details in PDF) |
7.7 g/10min |
0.960 g/㎤ |
Processability, Mechanical Properties, Bead Foaming Properties(SHOE SOLE, BUOY). | |
| VC500 (details in PDF) |
19,1 g/10min |
0.959 g/㎤ |
Processability, Electric Properties (Electric Wire BASE RESIN(outer semiconductive shield), Industrial Foams). | |
| VC590 (details in PDF) |
2,2 g/10min |
0.965 g/㎤ |
Processability, Electric Properties (Electric Wire BASE RESIN (outer semiconductive shield), Industrial Foams). | |
|
Coating |
VC640 (details in PDF) |
6,9 g/10min |
0.949 g/㎤ |
Processability, Electric Properties (Electric Wire BASE RESIN (inner semiconductive layer)). |
| VC700 (details in PDF) |
3,8 g/10min |
0.965 g/㎤ |
Processability, Electric Properties, Release Properties(Electric Wire BASE RESIN (outer semiconductive shield)). | |
| VC710 (details in PDF) |
0,40 g/10min |
0.959 g/㎤ |
Processability, Electric Properties, Release Properties(Electric Wire BASE RESIN (outer semiconductive shield)). | |
| VA700 (details in PDF) |
0,35 g/10min |
0.958 g/㎤ |
Processability, Adhesiveness(SOLAR CELL ENCAPSULANT, Hot Melt Adhesives for binding). | |
| VA600 (details in PDF) |
0,3 g/10min |
0,963 g/㎤ |
Processability, Adhesiveness(Hot Melt Adhesives for binding, Electric Wire BASE RESIN (outer semiconductive shield)). | |
| VA800 (details in PDF) |
0,04 / 5,0 g/10min |
0,951 g/㎤ |
Processability, Adhesiveness(Hot Melt Adhesives for binding, Automobile high-end mat coating). | |
| VA810 (details in PDF) |
0,35 g/10min |
0,962 g/㎤ |
Processability, Adhesiveness(Hot Melt Adhesives for binding, SOLAR CELL ENCAPSULANT). | |
|
Hot Melt Adhesive |
VA900 (details in PDF) |
0,20 g/10min |
0,961 g/㎤ |
Processability, Adhesiveness(Hot Melt Adhesives for binding & packaging) |
| VA910 (details in PDF) |
0,7 g/10min |
0,967 g/㎤ |
Processability, Adhesiveness(Hot Melt Adhesives for packaging) | |
| VA920 (details in PDF) |
0,35 g/10min |
0,958 g/㎤ |
Processability, Adhesiveness(Hot Melt Adhesives for STICK). | |
| VA930 (details in PDF) |
5,5 g/10min |
0,951 g/㎤ |
Processability, Adhesiveness(Hot Melt Adhesives for STICK). | |
| VE700 (details in PDF) |
0,2 g/10min |
0,940 g/㎤ |
Good transparency(Solar cell encapsulant). | |
| VE810 (details in PDF) |
20 g/10min |
0,959 g/㎤ |
Good adhesion(Solar cell encapsulant). | |
|
Extrusion/ |
VL740 (details in PDF) |
0,95 g/10min |
0,954 g/㎤ |
LOW NECK-IN, Adhesiveness (THERMAL LAMINATION). |
